SINGAPORE
Electronics
Mitsuboshi Belting products offer high reliability and performance in the manufacture of electronic materials and components. Conductive paste has high conductivity and reliability, and plays an important role in the manufacture of printed circuit boards and various electronic components. On the other hand, products for electronic component production lines combine high precision and high reliability, and demonstrate stable performance even in harsh manufacturing environments. This improves product quality and production efficiency, and enhances the productivity and reliability of electronic components.
Mobile Electronic Devices
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Our conductive paste is widely used as a bonding material for semiconductors, an electrode material for passive electronic components, and a wiring/heat dissipation material for circuit boards. Ultimately, it is implemented in various mobile electronic devices such as smartphones and PCs.
Data Center/Wireless Base Station
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Our via-filled substrates are used in circuit boards for AI servers in data centers equipped with artificial intelligence, contributing to improved high-frequency shielding and heat dissipation. Similarly, they are also used in wireless communication base stations.
Passive Electronic Components
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Mainly used as electrode materials for various passive electronic components such as chip resistors and capacitors.
Copper Clad laminate/PCB Substrate Pressing Process
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It is a continuously used cushioning material for the lamination press process of CCL and PCB. It enables uniform pressure distribution during pressing.
Semiconductor Manufacturing Process (Post-process)
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In the post-process of bonding semiconductors to substrates, our silver nanoparticles (filler material) and silver nanoparticle paste are used as high-quality electrical bonding materials, replacing traditional solder bonding materials.
