Conductor pastes (Ag-based)

This paste has high adhesion and high reliability to alumina and glass substrates, as well as to aluminum nitride substrates, which are difficult to adhere to. Further, to prevent sulfidation and migration, which are the demerits of Ag, Ni/Au plating can be applied.
Screen printing, screen offset printing, and dip coating are also possible.
We can customize the paste and print it on the substrates according to your specifications. Please contact us if you have any other requests.

Catalog

Product Details

Features

High adhesion reliability

Test Conditions
・After silver paste plating
・Thermal cycle test : -45℃⇔125℃
・Dstruction mode : in-solder destruction / substrate gouging
High adhesion reliability

Test Conditions
・After silver paste plating
・Thermal cycle test : -45℃⇔125℃
・Fracture mode : interfacial detachment

Application Example

- Wiring formation on LED mounting circuit package substrate (alumina substrate)
- Wiring formation on passive components (aluminum nitride substrate)
- Ceramic heater

Specification

Type	Conductor component	Feature	Resistivity (μΩ・cm)	Coating method	Adhesive strength (N/2mm□)	Recommended curing/firing condition	Substrate
HS109	Ag	Ion migration resistance, Good solderability, Nickel plateable	≦3	Screen printing	≧40	900 °C 10min	Al₂O₃
HS201	Ag	Nickel plateable	≦4	Screen printing	≧40	900 °C 10min	AlN
HS301	Ag	Good solderability, Nickel plateable	≦3	Screen printing	≧20	500–900 °C 10min	Glass, Al₂O₃
HS102P	AgPd	Pd 2%, 5% containing, Sulfur resistance, Ion migration resistance, Nickel plateable	Pd2% : ≦4	Screen printing	≧40	900 °C 10min	Al₂O₃
HS102P	AgPd		Pd5% : ≦6	Screen printing	≧40	900 °C 10min	Al₂O₃

Caution

The listed data represents typical values and does not guarantee performance or quality.
Product specifications are subject to change without notice.

Remarks

We also have silver pastes for various applications. Please contact us for requests such as adjusting the coating properties.