SINGAPORE
High-temperature Firing Pastes
Cu-based
Conductor pastes (Cu-based)
Product Details
Features
-
- There is a lineup for alumina substrates, aluminum nitride substrates, and multilayer thickened films without adhesion components.
- The viscosity and thixotropy can be adjusted according to the printing pattern.
- The firing film thickness is 5μm or more, and the firing temperature is 650℃ or higher.
- It does not contain environmentally hazardous substances such as Pb.
Achievement
- Chip resistors, internal electrode formation
- LED mounting circuit package substrate、electrode formation
Specification
| Type | Application/Feature | Resistivity (μΩ・cm) |
Adhesive strength (N/2mm□) | Recommended firing condition | Coating method | Substrate |
|---|---|---|---|---|---|---|
| DC014E | Fine pattern printing | < 3 | ≧20 | 900 °C 10min, In N₂ | Screen printing | Al₂O₃ |
| DC017 | Smooth surface, Good solderability | < 3 | ≧20 | 900 °C 10min, In N₂ | Screen printing | Al₂O₃ |
| AMR03 | Low temperature firing, Good solderability | < 3 | ≧20 | 650 °C 10min, In N₂ | Screen printing | Al₂O₃ |
| M22 | For AlN substrates | < 4 | ≧20 | 900 °C 10min, In N₂ | Screen printing | AIN |
| M29 | Fine pattern printing, Thin film forming (< 10μmt） |
< 4 | ≧20 | 900 °C 10min, In N₂ | Screen printing | Al₂O₃, AIN |
| GL19 | For multilayer thickened films, Film thickness up to 300μm |
< 4 | - | 650 °C 10min, In N₂ | Screen printing | Al₂O₃, AIN |
Caution
- It should be fired in a nitrogen atmosphere.
- Please check the Material Safety Data Sheet (SDS) for each product.
Remarks
- If you do not have a replacement nitrogen furnace, we can fire it on your behalf.
- We can also propose our resistive pastes and glass pastes that are well-matched with this product.