nemu

High-temperature Firing Pastes

CuAgTi-based

Conductor pastes(CuAgTi-based)

  • Conductor pastes(CuAgTi-based)サムネイル1
  • Conductor pastes(CuAgTi-based)サムネイル1

This is a thick film paste using active metal brazing material CuAgTi for bonding with ceramic substrates. It can be used to bond ceramics such as alumina, aluminum nitride, and silicon nitride. By layering copper paste on top of the active metal paste, an ultra-thick film conductor is formed.
Additionally, it is possible to laminate a copper plate with a ceramic substrate using an active metal paste as the bonding layer.

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Product Details

Features

  • By layering copper paste on the upper layer, it is possible to form an ultra-thick film of 0.3 mm or more.
  • It does not contain environmentally hazardous substances such as Pb and Cd.
  • It has excellent heat resistance, impact resistance, and reliability.
  • The metal film and substrate form a strong chemical bond, providing excellent adhesion to Si₃N₄ and AlN substrates.

Structure

  • Film thickness of less than 100 μm
    Film thickness of less than 100 μm

    ■Process
    (1) Substrate
    (2) Print the bonding layer (AS112)
    (3) Print the upper layer of the bonding layer (DC014GL)
    (4) Firing, e.g. 850℃, N₂ atmosphere

  • Film thickness of 100 μm or more
    Film thickness of 100 μm or more

    For a film thickness of 100 μm or more, the following process is added.
    ■Process
    (5) Print the thickening layer (GL39)
    (6) Firing, e.g. 800℃, N₂ atmosphere

  • Substrate image after firing
    Substrate image after firing

    Copper paste thick film (50μm) fired substrate using an active metal paste as the bonding layer.
    (1) SiN
    (2) Copper

  • Cross-section SEM image
    Cross-section SEM image

    Substrate image after firing
    (1) Copper film
    (2) Active metal containing bonding layer (structural formula: Ti5Si3)
    (3) SiN substrate

Application Example

    • Ceramic heat dissipation circuit packages for power devices
    • Ceramic circuit boards and ceramic packages that require high reliability

Specification

Type Film thickness Application Feature Conductor component Adhesive Strength (N/2mm²) Recommended firing condition Coating method Substrate
100μm< 100μm≧
AS112 ○ ○ Thick film conductor wiring, Electrode formation (bonding layer with ceramic substrate) High bonding strength, High thermal reliability Ag,
Cu,
Ti		 ≧30

850 °C 10min,
In N₂

 Screen printing Al₂O₃,
AlN,
Si₃N₄
DC014GL ○ ○ Thick film conductor wiring, Electrode formation High surface smoothness, Larger film thickness can be formed in a single print Cu - 850 °C 10min,
In N₂		 Screen printing Al₂O₃,
AlN,
Si₃N₄
GL39 - ○ Ultra-thick film conductor wiring, Electrode formation（for multilayer thickening） Larger film thickness can be formed in a single print Cu - 800 °C 10min,
In N₂		 Screen printing Al₂O₃,
AlN,
Si₃N₄

Caution

  • It should be fired in a nitrogen atmosphere.
  • Please check the Material Safety Data Sheet (SDS) for each product.

Remarks

If you do not have a replacement nitrogen furnace, we can fire it on your behalf.