High-temperature Firing Pastes

Glass pastes

As chip resistors become smaller, the power consumption per component size increases, and in some cases, the protection of the resistive parts with resin is not sufficient.
By combining this glass paste with a copper conductor and a thick-film base material with a resistive paste, it demonstrates good anti-oxidation performance even under conditions where the temperature of the resistive part reaches 300 to 400℃, such as in ceramic heater applications.

Catalog

Product Details

Features

- It is possible to form a protective film with very little soot even in a nitrogen atmosphere.
- The color of the fired film can be adjusted.

Application Example

- Chip resistors for current detection
- Chip resistors for power supply management
- Ceramic heaters
- Other ceramic circuit boards with resistive elements

Specification

Type	Color	Viscosity(Pa・s)	Fired thickness(μΩ)	Coverage(cm²/g)	Recommended firing condition	Substrate
OCG12	Clear	50-100	15-18	150	900 °C 10min, In N₂	Al₂O₃
OCG03	White	50-100	10-15	146	780 °C 10min, In N₂	AlN
OCG07	Turquoise	100-200	10-15	146	850 °C 10min, In N₂	Al₂O₃

Caution

Please check the Material Safety Data Sheet (SDS) for each product.

Remarks

There is a chemical affinity between the conductive paste and the resistive paste used in thick-film components. We recommend using our products.
We also accept orders for firing in development and production. Please feel free to contact us.