High-temperature Firing Pastes

Resistive pastes

There has been a growing demand for measures to prevent the sulfidation of Ag electrodes and improve migration resistance in resistive components and chip resistors (SMD). Copper-based conductors can be used for this purpose.
Our Cu/Ni-based base metal thick film resistive paste does not become unstable even when fired in a nitrogen atmosphere. We can also produce pastes that correspond to the ultra-low resistance range.

Catalog

Product Details

Features

It can be fired in a nitrogen atmosphere.　It is also possible to use with substrates that have copper electrodes and wiring.
Compared to Ag/Pd alloy and ruthenium oxide-based resistive materials, it is inexpensive.
It does not contain environmentally hazardous substances such as Pb.
Low-resistance Cu/Ni paste has a low TCR and can meet chip resistor quality requirements of ±100ppm.

Application Example

- Chip resistors for current detection
- Chip resistors for power supply management
- Ceramic heaters
- Ceramic circuit substrate with resistive element

Specification

CuNi resistive pastes

Series	Type	Sheet resistance (mΩ/□ @20μmt)	Resistance temperature coefficient (ppm/°C)		Viscosity (Pa･s)	Fired Thickness*²(μm)	Coverage（cm²/g）	Recommended firing condition
Series	Type	Sheet resistance (mΩ/□ @20μmt)	HTCR*¹	CTCR*¹	Viscosity (Pa･s)	Fired Thickness*²(μm)	Coverage（cm²/g）	Recommended firing condition
DH	CNR01DH	10	+500±50	+500±50	30~50	18~20	55	900 °C 10min, In N₂
DH	CNR03DH	30	-100±50	-80±50	30~50	18~20	55	900 °C 10min, In N₂
D	CNR10D	100	-90±50	-70±50	30~50	20~25	68	900 °C 10min, In N₂
	CNR50D	500	-60±50	-30±50	30~50	20~25	76	900 °C 10min, In N₂
	CN1R5D	1,500	-40±50	-10±50	30~50	20~25	80	900 °C 10min, In N₂
	CN3R0D	4,000	-10±50	+30±50	30~50	20~25	82	900 °C 10min, In N₂

Substrate: Al₂O₃, Electrode: Cu, Coating method: Screen printing, Storage condition: Refrigerated
*¹ HTCR：25℃～155℃, CTCR：-55℃～25℃
*² When using standard screen plate, mesh wire diameter: #250-φ30μm, calendar processing, emulsion thickness: 30μm
The resistance value can be adjusted by blending the DH series and D series.

LaB6 resistive pastes

Series	Type	Sheet resistance (mΩ/□ @20μmt)	Resistance temperature coefficient (ppm/°C)	Viscosity (Pa･s)	Fired Thickness*²(μm)	Coverage（cm²/g）	Electrode	Recommended firing condition	Substrate
A	LB3A	3	+330	50-100	18-20	96	Cu	850 °C 10min, In N₂	Al₂O₃
	LB10A	10	+170	50-100	18-20	102	Cu	850 °C 10min, In N₂	Al₂O₃
	LB100A	100	+40	50-100	18-20	109	Cu	850 °C 10min, In N₂	Al₂O₃
	LB1kA	1,000	-10	50-100	18-20	114	Cu	850 °C 10min, In N₂	Al₂O₃
N	LB20N	20	+200	50-100	22-25	105	Ag	820 °C 10min, In N₂	AlN
	LB100N	100	+70	50-100	22-25	108	Ag	820 °C 10min, In N₂	AlN
	LB1kN	1,000	+10	50-100	22-25	113	Ag	820 °C 10min, In N₂	AlN

Coating method: Screen printing, Storage condition: Refrigerated
*¹ When using the standard screen printing plate Mesh:#250-φ30μm, Thickness of emulsion：10μm

Caution

Please check the Material Safety Data Sheet (SDS) for each product.

Remarks

If you do not have a replacement nitrogen furnace, we can fire it on your behalf.
We also accept orders for firing in development and production. Please feel free to contact us.
These results are based on the use of our copper paste for the electrode and our glass paste for the protective film.
There is a chemical affinity between the resistive element, copper paste, and glass paste, so we recommend using our products.