Active metal pastes（ CuAgTi-based） for bonding between copper plate and ceramics

Our active metal CuAgTi thick-film paste can be bonded in a nitrogen atmosphere. It bonds strongly to ceramics such as alumina and aluminum nitride, as well as to silicon nitride, which is difficult to bond.
By layering copper paste on top of the active metal paste, it is possible to form ultra-thick film conductors. It can also be used as a paste for bonding ceramic substrates and copper plates.

Catalog

Product Details

Features

- This paste bonds firmly to Si₃N₄ substrates, which are difficult to bond.
- It has excellent thermal shock resistance.
- It can be bonded in a continuous furnace in a nitrogen atmosphere.

Structure

Firing example in a continuous furnace

Copper plate laminating using an active metal paste in the bonding layer.

(1) Mesh belt
(2) Alumina substrate
(3) Cu plate
(4) Paste
(5) Ceramic substrate
(6) Weight (40g/㎠)
Cross-sectional SEM image

(1) Cu plate
(2) AIN substrate
(3) Bonding layer

Bonding sample of copper plate and silicon nitride substrate, using active metal paste

Application Example

Ceramic heat-dissipating circuit packages for power devices

Specification

Type	Application	Feature	Conductor component	Adhesive strength (N/2mm²)	Recommended firing condition	Coating method	Substrates
AS102	Bonding between copper and ceramic substrates	High bonding strength, High thermal reliability	Ag, Cu, Ti	≧30	850 °C 10min, In N₂	Screen printing	Al₂O₃, AlN, Si₃N₄

Caution

It should be fired in a nitrogen atmosphere.
Please check the Material Safety Data Sheet (SDS) for each product.

Remarks

If you do not have a replacement nitrogen furnace, we can fire it on your behalf.