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High-temperature Firing Pastes

Transfer printing paste

  • Transfer printing pasteサムネイル1
  • Transfer printing pasteサムネイル1

This is a conductive paste suitable for screen offset printing and pad printing. It can be transferred to 3D shapes and curved surfaces.

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Product Details

Features

    • It is compatible with screen offset and pad printing.
    • It is possible to print on uneven or curved surfaces.
    • We have a proven track record in using Ag pastes and Cu pastes.

Specification

Type Conductor component Application/Feature Resistivity
(μΩ・cm)		 Coating method Adhesive strength
(N/2mm²)		 Recommended firing condition Substrates
HS101T2 Ag For screen offset printing, Nickel platable ≦3 Screen offset printing, Screen pad printing ≧40 900 °C 10min, In N₂ Al₂O₃

Caution

  • The listed data represents typical values and does not guarantee performance or quality.
  • Product specifications are subject to change without notice.