SINGAPORE
Cu-based
High-temperature Firing Pastes
CuNi resistive pastes for chip resistors
Product Details
Features
-
- It has high reliability against oxidation, which is a concern with copper-based materials.
- It is also suitable for countermeasures against sulfidation and ion migration.
- The resistance range is 10mΩ to 3.0Ω, making it ideal for current detection and power management chip resistors.
- It is a base metal material and is ideal as an alternative to silver-palladium resistors, which are expensive and have a high risk of price fluctuation.
- With a low TCR of ±50ppm/K and good control, it also meets the quality requirements for chip resistors of ±100ppm.
- It does not contain environmentally hazardous substances such as Pb.
Structure
Example of use on Al₂O₃ substrate
-
(1) Al₂O₃ substrate
(2) Copper electrode
(3) CuNi resistive pastes for chip resistor
(4) Overcoat glass
Application Example
-
- Chip resistors for current detection
- Chip resistors for power supply management
- Ceramic heaters
- Ceramic circuit substrate with resistive element
Specification
CuNi resistive pastes for resistors
| Series | Type | Sheet resistance (mΩ/□ @20μmt) |
Resistance temperature coefficient(ppm/°C) | Viscosity (Pa･s) |
Fired Thickness*²(μm) | Coverage（cm²/g） | Recommended firing condition | |
|---|---|---|---|---|---|---|---|---|
| HTCR*¹ | CTCR*¹ | |||||||
| DH | CNR01DH | 10 | +500±50 | +500±50 | 30~50 | 18~20 | 55 | 900 °C 10min, In N₂ |
| CNR03DH | 30 | -100±50 | -80±50 | 30~50 | 18~20 | 55 | 900 °C 10min, In N₂ | |
| D | CNR10D | 100 | -90±50 | -70±50 | 30~50 | 20~25 | 68 | 900 °C 10min, In N₂ |
| CNR50D | 500 | -60±50 | -30±50 | 30~50 | 20~25 | 76 | 900 °C 10min, In N₂ | |
| CN1R5D | 1,500 | -40±50 | -10±50 | 30~50 | 20~25 | 80 | 900 °C 10min, In N₂ | |
| CN3R0D | 4,000 | -10±50 | +30±50 | 30~50 | 20~25 | 82 | 900 °C 10min, In N₂ | |
Substrate: Al₂O₃, Electrode: Cu, Coating method: Screen printing, Storage condition: Refrigerated
*¹ HTCR:25℃～155℃, CTCR:-55℃～25℃
*² When using standard screen plate, mesh wire diameter: #250-φ30μm, calendar processing, emulsion thickness: 30μm
The resistance value can be adjusted by blending the DH series and D series.
Copper paste for electrodes
| Type | Resistivity(μΩ･cm) | Viscosity(Pa･s) | Fired Thickness*³(μm) | Coverage（cm²/g） | Recommended firing condition |
|---|---|---|---|---|---|
| DC019（Surface） | ≦ 4 | 75±25 | Ca. 13 | 85 | 900 °C 10min, In N₂ |
| DC019U（Back） | ≦ 4 | 75±25 | Ca. 7 | 150 | 900 °C 10min, In N₂ |
Substrate: Al₂O₃, Coating method: Screen printing, Storage condition: Refrigerated
*³ When using standard screen plate
(DC019) Mesh wire diameter: #250-φ30μm, emulsion thickness: 10μm
(DC019U) Mesh wire diameter: #400-φ19μm, emulsion thickness: 10μm
Glass paste for overcoat
| Type | Color | Viscosity (Pa･s) | Fired Thickness*⁴(μm) | Coverage（cm²/g) | insulation(Ω) | Acid resistance*⁵ | Recommended firing condition |
|---|---|---|---|---|---|---|---|
| OCG12 | Grayish white transparent | 60±30 | Ca. 13 | 250 | 8.0×1011 | <3.0 | 850-900 °C 10min, In N₂ |
Substrate: Al₂O₃, Coating method: Screen printing, Storage condition: Refrigerated
*⁴ When using standard screen plate, mesh wire diameter: #400-φ19μm, emulsion thickness: 30μm
*⁵ Evaluation method: % weight loss after 1 hour immersion in 0.5wt% sulfuric acid
Caution
Please check the Material Safety Data Sheet (SDS) for each product.
Remarks
- If you do not have a replacement nitrogen furnace, we can fire it on your behalf.
- These results are based on the use of our copper paste for the electrode and our glass paste for the protective film.
