nemu

Silver/Silver Nanoparticle Applied Products (Pastes, Inks, Slurries)

Silver sintering paste for die attachment

  • Silver sintering paste for die attachmentサムネイル1
  • Silver sintering paste for die attachmentサムネイル1

Applying silver nanoparticle technology with excellent low-temperature sintering properties, we have developed this sintering paste with high thermal conductivity and high bonding reliability.

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Product Details

Features

  • It has high thermal conductivity.
  • Low-temperature sintering is possible.
  • A high-density bonding layer can be formed.
  • Cross-section: Pressure-less bonding

    Cross-section: Pressure-less bonding

  • Cross-section: Pressure bonding

    Cross-section: Pressure bonding

Specification

Type Feature Application Resistivity Adhesive strength Thermal conductivity Sintering condition
S310

Pressure-less bonding

Power IC, LED, Si, SiC, GaN

2.7μΩ・cm

100MPa

>200W/m・K 

200℃, 1h
S280

Pressure bonding

Power IC, Si, SiC, GaN

＜4μΩ・cm

＞50MPa

>200W/m・K

10MPa,
250～300℃,
＞2min

Caution

  • The listed data represents typical values and does not guarantee performance or quality.
  • Product specifications are subject to change without notice.

Remarks

  • We also have a lineup of silver pastes for various applications.　
  • Please contact us for any requests, such as adjusting the coating properties.