nemu

Press Sub-materials

Cushioning material for heat press

  • Cushioning material for heat pressサムネイル1
  • Cushioning material for heat pressサムネイル1

This is a continuous-use cushioning material used for pressing prepreg and copper foil in copper-clad laminates (CCL) and for pressing printed circuit boards (PCB). It contributes to improving the productivity of multi-opening heat press process and reducing industrial waste. It can also be used in press forming, where microstrain relaxation is required.

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Product Details

Features

    • It can be used continuously at 230℃ and has excellent cushioning and durability.
    • It suppresses corrosion of the heating plate (SS400 material) during long-term continuous use.
    • Max. fabrication size： 1300×2800mm. The thickness of the cushion can be adjusted.
    • There are also specifications that can be rolled up or transported by suction.

Structure

F type

  • Material construction
    Material construction

    (1) Surfacing material: Fluororesin-impregnated glass cloth
    (2) Buffer material: glass cloth
    (3) Rubber

  • Cross-sectional image
    Cross-sectional image

M15 type

  • Material construction
    Material construction

    (1) Surfacing material: Aramid fiber cloth
    (2) Buffer material: Glass cloth
    (3) Rubber

  • Cross-sectional image
    Cross-sectional image

Specification

F type

Specification Standard thickness
F-1ply 1.6mm ± 0.3mm
F-2ply 2.7mm ± 0.4mm
F-3ply 3.6mm ± 0.5mm

M15 type

Specification Standard thickness
M15-1ply 1.6mm ± 0.3mm
M15-2ply 2.7mm ± 0.4mm
M15-3ply 3.6mm ± 0.5mm