Via-filling Solutions

Via-filling substrate

With a high-conductivity, non-shrinkage filling method using a proprietary copper paste, it is possible to fill various vias uniformly.
We have a proven track record of adoption in communication-related ceramic packages that require high reliability.
We sell this via-filling substrate as a semi-finished product with via-filling processing on the ceramic substrate. We can also perform drilling, via filling, and polishing.

Catalog

Product Details

Features

- It has excellent reliability, precision, and heat dissipation.
- It complies with RoHS2.
- It adheres firmly to the substrate.
- The surface of the board can be finished smoothly, allowing components to be mounted directly above the filled vias.
- Uniform via filling with few voids or gaps is possible.
- It can also be used for high-airtight applications (AgCu alloy dense filling) that suppress voids and gaps.

Application Example

Various types of package boards and module boards that require high reliability and heat dissipation

Specification

	Substrate Material	Substrate Size*¹(inch)	Board thickness*²(mm)	Hole diameter*³(mm)	Hole diameter aspect ratio*¹	Resistivity(μΩcm)	Filling section unevenness（No polishing）	Filling section unevenness（With lap polishing）	Section unevenness（with mirror polishing）
Cu filling	AIN, Al₂O₃, SiN, Machinable ceramics, Sapphire, SiO₂	2×2～4.5×4.5	0.2~1.0	0.05~2.0	1.0~10.0	5~7	≦ ±30μm	≦ ±3μm	≦ ±1μm
Ag filling	AIN, Al₂O₃, SiN, Machinable ceramics, Sapphire, SiO₂			0.05~1.0	1.0~10.0	3~4	≦ ±30μm		≦ ±2μm
AgCu alloy dense filling	AIN, Al₂O₃, SiN, Machinable ceramics			0.05~1.0	1.0~6.5	-	Polishing is essential.		≦ ±2μm

*¹ There are exceptions depending on the hole diameter and plate thickness.
*² Please contact us for thicknesses other than those listed above.
*³ There are exceptions depending on the plate thickness.

Caution

The data and specifications above are just examples.

Remarks

Please contact us about filling vias with paste other than copper.